Array substrate and manufacturing method thereof and display device

ABSTRACT

A manufacturing method of an array substrate comprises: forming a source and a drain of a thin film transistor on a base; forming a first insulation layer; forming an active layer of the thin film transistor; forming a second insulation layer; forming a first via hole and a second via hole in the first insulation layer and the second insulation layer above the source and the drain, by etching, and forming a third via hole and a fourth via hole in the second insulation layer above the active layer, by etching; forming a first connection line connecting the source with the active layer through the first via hole and the third via hole, a second connection line connecting the drain with the active layer and the pixel electrode through the second via hole and the fourth via hole and a pixel electrode.

FIELD

The present application relates to the field of display technology, andparticularly to an array substrate and a manufacturing method thereof,and a display device.

BACKGROUND

With the development of display technology, people's demand on imagequality is increasing, and flat panel display devices with high qualityand high resolution are becoming more and more popular, and have beenpaid more and more attention by display panel manufacturers.

Thin film transistors (TFTs) are main driving devices in a flat displaypanel, which directly affect the development direction of highperformance flat panel display devices. A thin film transistor may be ofvarious structures, and there are various materials for manufacturingthe thin film transistors of corresponding structures, for example,amorphous silicon and polysilicon are commonly used in the manufactureof thin film transistors. However, amorphous silicon itself has manyinherent shortcomings such as low mobility and low stability, and incontrast, low temperature polysilicon (LTPS) has high stability andmobility which may be, for example, up to tens or even hundreds of timesof that of amorphous silicon. Therefore, the technique in which the thinfilm transistor is made of low temperature polysilicon has beendeveloped rapidly, and new generation liquid crystal display (LCD)devices or organic light-emitting diode (OLED) display devices derivedfrom LTPS have become an important display technology, especially theOLED display devices have been acclaimed by users for theircharacteristics such as ultra-thinness, low power consumption andself-emission.

FIG. 1 is a sectional diagram of a structure of a LTPS TFT arraysubstrate in the prior art. The array substrate comprises a buffer layer2, an active layer 3, a first insulation layer 4′, a gate 5, a secondinsulation layer 6′, a source 71, a drain 72, a third insulation layer8′, a planarization layer 9 and a pixel electrode 10 sequentiallyprovided on a base 1. At present, the array substrate of this structuremay be manufactured by eight patterning processes using eight masks,wherein the eight patterning processes include:

forming a pattern including the active layer 3 through a firstpatterning process by using an active layer mask (a-Si Mask);

performing a partial p-Si doping on the first insulation layer 4′ toform a pattern including a first plate 11 of a storage capacitor Csthrough a second patterning process by using a storage capacitor mask(Cs mask). In this step, the first plate 11 of the storage capacitor Csis formed by doping through a first ion implantation, however, thestorage capacitor Cs in which the first plate 11 formed by using the ionimplantation has a disadvantage of slow charging and discharging;

forming a pattern including a gate 5 and a second plate 12 of thestorage capacitor Cs through a third patterning process by using a gatemask. In this step, a gate metal is used as the second plate 12 of thestorage capacitor Cs;

forming a pattern including contact holes connecting the source 71 andthe drain 72 with the active layer 3 in the second insulation layer 6′through a fourth patterning process by using a contact mask;

forming a pattern including the source 71 and the drain 72 through afifth patterning process by using a source/drain mask (S/D mask);

forming a pattern including a bridge via hole between the pixelelectrode 10 and the drain 72 in the third insulation layer 8′ through asixth patterning process by using a via hole mask;

forming a pattern including a bridge via hole between the pixelelectrode 10 and the drain 72 in the planarization layer 9 through aseventh patterning process by using a planarization mask (PLN mask), andmaking the array substrate be planarized so as to deposit a electrodelayer on the planarized substrate; and

forming a pattern including the pixel electrode 10 through an eighthpatterning process by using a pixel electrode mask (ITO mask).

It can be seen that the existing manufacturing process for the arraysubstrate including the LTPS and Cs is complicate and has relativelymore procedures, resulting in a high production cost.

SUMMARY

In view of the above problems in existing manufacturing method of thearray substrate, the present application provides an array substrate,which is simple in manufacturing process and low in production cost, amanufacturing method thereof, and a display device.

A solution employed to solve the technical problems is a manufacturingmethod of an array substrate, which comprises the following steps of:

forming a pattern including a source and a drain of a thin filmtransistor on a base through a patterning process;

forming a first insulation layer;

forming a pattern including an active layer of the thin film transistorthrough a patterning process;

forming a second insulation layer, forming a first via hole and a secondvia hole in the first insulation layer and the second insulation layerabove the source and the drain, respectively, by etching, and forming athird via hole and a fourth via hole in the second insulation layerabove a source contact region and a drain contact region of the activelayer, respectively, by etching;

forming a pattern including a first connection line, a second connectionline and a pixel electrode through a patterning process, wherein thefirst connection line connects the source with the source contact regionof the active layer through the first via hole and the third via hole,the second connection line connects the drain with the drain contactregion of the active layer and the pixel electrode through the secondvia hole and the fourth via hole.

Optionally, the step of forming the second insulation layer comprises astep of:

forming a gate insulation layer and forming a planarization layer,

the manufacturing method further comprises a step of:

between forming the gate insulation layer and forming the planarizationlayer, forming a pattern including a gate of the thin film transistorthrough a patterning process.

Further optionally, orthographic projections of the gate and aconductive channel region of the active layer on the base completelycoincide with each other, and after forming the pattern including thegate through a patterning process, the manufacturing method furthercomprises a step of:

performing an ion implantation on the active layer to form the sourcecontact region and the drain contact region.

Further optionally, while forming the pattern including the active layerof the thin film transistor through a patterning process, themanufacturing method further comprises a step of:

forming a pattern including a first plate of a storage capacitor, and

-   -   while performing the ion implantation on the active layer to        form the source contact region and the drain contact region, the        manufacturing method further comprises a step of:

performing an ion implantation on the first plate of the storagecapacitor.

Optionally, while forming the pattern including the source and the drainof the thin film transistor through a patterning process, themanufacturing method further comprises a step of:

forming a pattern including the gate of the thin film transistor.

Optionally, while forming the pattern including the source and the drainof the thin film transistor through a patterning process, themanufacturing method further comprises a step of:

forming a pattern including a second plate of the storage capacitor.

Optionally, the step of forming the first via hole and the second viahole in the first insulation layer and the second insulation layer abovethe source and the drain, respectively, by etching; and forming a thirdvia hole and a fourth via hole in the second insulation layer above thesource contact region and the drain contact region of the active layer,respectively, by etching specifically comprises steps of: first, etchingregions, which correspond to the first though hole and the second viahole, in the first insulation layer and the second insulation layerabove the source and the drain; and

next, etching regions, which correspond to the third via hole and afourth via hole, in the second insulation layer above the source contactregion and the drain contact region of the active layer.

Further optionally, etching gas used in etching the second insulationlayer to form the third via hole and the fourth via hole is C_(x)F_(y).

Optionally, after the pattern including the pixel electrode is formed,the manufacturing method further comprises a step of:

forming a pattern including a pixel defining layer and a spacer througha single patterning process.

A solution employed to solve the technical problems is an arraysubstrate, which comprises:

a base;

a source and a drain of a thin film transistor above the base;

a first insulation layer above a layer in which the source and the drainare located;

an active layer of the thin film transistor above the first insulationlayer;

a second insulation layer above a layer in which the active layer islocated;

a first connection line, a second connection line and a pixel electrodeabove a layer in which the second insulation layer is located, wherein

the first connection line connects the source with the source contactregion of the active layer via the first via hole penetrating throughthe first insulation and the second insulation layer above the sourceand the third via hole penetrating through the second insulation layerabove the source contact region of the active layer , the secondconnection line connects the drain with the drain contact region of theactive layer and the pixel electrode via the second via hole penetratingthrough the first insulation layer and the second insulation layer abovethe drain and the fourth via hole penetrating through the secondinsulation layer above the drain contact region of the active layer.

Optionally, the second insulation layer includes a gate insulation layerand a planarization layer, and the array substrate further comprises agate of the thin film transistor provided between the gate insulationlayer and the planarization layer.

Optionally, orthographic projections of the gate and a conductivechannel region of the active layer on the base completely coincide witheach other, and the source contact region and the drain contact regionof the active layer are doped with ions.

Further optionally, the array substrate further comprises a first plateof a storage capacitor, wherein the first plate and the active layer arein a same layer and are formed of a same material, and the first plateis doped with ions.

Optionally, the array substrate further comprises a gate of the thinfilm transistor, wherein the gate and the source and the drain are in asame layer and are made of a same material.

Optionally, the array substrate further comprises a second plate of thestorage capacitor, wherein the second plate and the source and the drainare in a same layer and are made of a same material.

A solution employed to solve the technical problems is an arraysubstrate comprising the above array substrate.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a structural diagram of an existing array substrate;

FIG. 2 is a diagram illustrating a first step of a manufacturing methodof the array substrate in a first embodiment of the present application;

FIG. 3 is a diagram illustrating a second step of the manufacturingmethod of the array substrate in the first embodiment of the presentapplication;

FIG. 4 is a diagram illustrating a third step of the manufacturingmethod of the array substrate in the first embodiment of the presentapplication;

FIG. 5 is a diagram illustrating a fourth step of the manufacturingmethod of the array substrate in the first embodiment of the presentapplication;

FIG. 6 is a diagram illustrating a fifth step of the manufacturingmethod of the array substrate in the first embodiment of the presentapplication; and

FIG. 7 is a diagram illustrating a seventh step of the manufacturingmethod of the array substrate in the first embodiment of the presentapplication.

DETAILED DESCRIPTION OF THE EMBODIMENTS

To make persons skilled in the art better understand solutions of thepresent application, description of the present application will bedescribed in detail below in conjunction with the accompanying drawingsand specific implementations.

In the present application, a patterning process may only include aphotolithography process or may include a photolithography process andan etching step, and in addition, may further include other processesfor forming a predetermined pattern, such as a printing and ink jet. Thephotolithography refers to a process which includes procedures such as afilm forming, an exposure and a development and the like, and forms apattern by using a photoresist, a mask and an exposure machine and thelike. A corresponding patterning process may be selected in accordancewith a structure to be formed.

First Embodiment

With reference to FIGS. 2 to 7, the present embodiment provides amanufacturing method of an array substrate, which specifically comprisesthe following steps.

Step 1, sequentially depositing a buffer layer 2 and a source-drainmetal film on a base 1, and forming a pattern including a source 71 anda drain 72 of a thin film transistor and a second plate 12 (a lowerplate) of a storage capacitor through a single patterning process, asshown in FIG. 2.

In this step, the base 1 is made of a transparent material such as glassand is cleaned in advance. Specifically, first, the source-drain metalfilm is formed on the base 1 by using a sputtering method, a thermalevaporation method, a Plasma Enhanced Vapor Deposition (PECVD) method, aLow Pressure Chemical Vapor Deposition (LPCVD) method, an AtmosphericPressure Chemical Vapor Deposition (APCVD) method, or an ElectronCyclotron Resonance Chemical Vapor Deposition (ECR-CVD) method. Then, apattern including a source 71, a drain 72 and a second plate 12 isformed through a first patterning process (which includes a filmforming, an exposure, a development, a wet etching or a dry etching).

Step 2, on the base 1 subject to the step 1, sequentially depositing afirst insulation layer 4′ and an amorphous silicon film (a-Si), andforming a pattern including an active layer 3 of the thin filmtransistor and a first plate 11 (a top plate) of the storage capacitorthrough a patterning process, as shown in FIG. 3.

In this step, first, deposition methods include a Plasma Enhanced VaporDeposition method and a Low Pressure Chemical Vapor Deposition method;

Then, the amorphous silicon film is crystallized so as to convert theamorphous silicon film 30 into a polysilicon film (p-Si), whereincrystallization method may be an excimer laser crystallization method, ametal induced crystallization method or a solid phase crystallizationmethod. Then the polysilicon film (p-Si) is doped (p-type doped orn-type doped) to decide a conduction type of a conductive channel regionof the thin film transistor TFT. The excimer laser crystallizationmethod and the metal induced crystallization method are low temperaturepolysilicon methods, which are frequently used to convert the amorphoussilicon into the polysilicon. However, methods used for converting theamorphous silicon into the polysilicon in the present application arenot limited to the above low temperature polysilicon methods, so long asthe active layer 3 may be converted into a desired polysilicon film.

Step 3, on the base 1 subject to the step 2, sequentially depositing agate insulation layer 6 (that is, a first level structure of a secondinsulation layer) and a gate metal film, and forming a gate 5 through apatterning process, as shown in FIG. 4.

In this step, first, the gate insulation layer is formed above theactive layer 3 and the first plate 11 by using a Plasma Enhanced VaporDeposition (PECVD) method, a Low Pressure Chemical Vapor Deposition(LPCVD) method, an Atmospheric Pressure Chemical Vapor Deposition(APCVD) method, an Electron Cyclotron Resonance Chemical VaporDeposition (ECR-CVD) method, or a sputtering method. Next, the gatemetal film is deposited by using a sputtering method, a thermalevaporation method, a Plasma Enhanced Vapor Deposition (PECVD) method, aLow Pressure Chemical Vapor Deposition (LPCVD) method, an AtmosphericPressure Chemical Vapor Deposition (APCVD) method, or an ElectronCyclotron Resonance Chemical Vapor Deposition (ECR-CVD) method. Finally,the pattern including a gate 5 of the thin film transistor is formedthrough a patterning process, wherein orthographic projections of thegate 5 and the conductive channel region of the active layer on the base1 completely coincide with each other.

This step further comprises a step of: doping corresponding portions ofthe active layer (p-Si) 3 to form a source contact region and a draincontact region, so as to enhance ohmic contact between the active layer3 and the source 71 and the drain 72, thus good ohmic contact betweenthe p-Si and the source 71 and the drain 72 can be ensured. A region ofthe active layer 3 corresponding to the gate 5 need not to be doped,since this doping is performed after the etching of the pattern of thegate 5, p-Si in the region of the active layer 3 corresponding to thegate 5 cannot be doped due to blockage of the gate 5. Meanwhile, thep-Si in the region of the active layer 3 corresponding to the gate 5will act as a channel and thus need not to be doped. Ion implantationmethods include an ion implantation method with mass analyzer, an ioncloud implantation method without mass analyzer, a plasma implantationmethod or a solid state diffusion implantation method. That is, in thisembodiment, through a plurality of steps including a crystallizationstep, a doping step and an ion implantation step and the like, the lowtemperature polysilicon is finally formed as the active layer 3 withgood semiconductor property. Certainly, ion implantation is performed onthe first plate 11 of the storage capacitor while doping the sourcecontact region and the drain contact region, so as to enhance theelectric characteristics of the first plate 11.

Step 4, on the base 1 subject to the step 3, depositing a planarizationlayer 9 (a second level structure of the second insulation layer), andforming, by etching, a first via hole and a second via hole in the firstinsulation layer 4′, the gate insulation layer 6 and the planarizationlayer 9 above the source 71 and the drain 72; and forming, by etching, athird via hole and a fourth via hole in the gate insulation layer 6 andthe planarization layer 9 above the source contact region and the draincontact region of the active layer 3, as shown in FIG. 5.

In this step, first, the source contact region and the drain contactregion of the active layer 3 become semi-transmittance regions by usinga half tone mask (HTM) or a gray tone mask (GTM), so that, afterexposure, a part of photoresist is remained in these regions. Afterthis, when performing a plasma etching, regions corresponding to thefirst via hole and the second via hole are etched first, and followingremoval of the photoresist on the surface of the array substrate,regions corresponding to the third via hole and the fourth via hole areetched. Specifically, the first via hole and the second via hole may beformed first by etching, and following the removal of the photoresist onthe surface of the array substrate, the third via hole and the fourthvia hole are finally formed by etching. Since the source 71 and thedrain 72 are below the first via hole and the second via hole, anetching gas used in the etching is C_(x)F_(y) gas, which cannot etchmetal so that structures of the source 71 and the drain 72 cannot bedamaged. It should be noted that, the C_(x)F_(y) gas refers to acompound containing C (carbon) and F (fluorine), such as CF₄ (carbontetrafluoride), C₄F₈ (octafluorocyclobutane), C₂HF₅ (pentafluoroethane)or the like.

Step 5, on the base 1 subject to the step 4, forming a pattern includinga first connection line 81, a second connection line 82 and a pixelelectrode 10 through a patterning process, wherein the first connectionline 81 connects the source 71 with the source contact region of theactive layer 3 through the first via hole and the third via hole; thesecond connection line 82 connects the drain 72 with the drain contactregion of the active layer 3 and the pixel electrode 10 through thesecond via hole and the fourth via hole, as shown in FIG. 6.

In this step, a conductive metal film is deposited by using a sputteringmethod, a thermal evaporation method, a Plasma Enhanced Vapor Deposition(PECVD) method, a Low Pressure Chemical Vapor Deposition (LPCVD) method,an Atmospheric Pressure Chemical Vapor Deposition (APCVD) method, or anElectron Cyclotron Resonance Chemical Vapor Deposition (ECR-CVD) method.The conductive metal film has a high reflectivity and satisfies acertain requirement to work function of metal, and is generally of adouble-layered-film structure or a three-layered-film structure, such asan ITO (indium tin oxide)/Ag (silver)/ITO (indium tin oxide) or Ag(silver)/ITO (indium tin oxide); alternatively, ITO of the abovestructure may be replaced by IZO (indium zinc oxide), IGZO (indiumgallium zinc oxide) or InGaSnO (indium gallium tin oxide). Certainly,the conductive metal film may also be made of inorganic metal oxide,organic conductive polymer or metal material with conductive propertyand high work function, wherein the inorganic metal oxide includesindium tin oxide or zinc oxide, the organic conductive polymer includesPEDOT:SS, PANI, and the metal material includes gold, copper, silver orplatinum.

Next, the pattern including a first connection line 81, a secondconnection line 82 and a pixel electrode 10 is formed through a singlepatterning process, wherein the first connection line 81 connects thesource 71 with the source contact region of the active layer 3 throughthe first via hole and the third via hole; the second connection line 82connects the drain 72 with the drain contact region of the active layer3 and the pixel electrode 10 through the second via hole and the fourthvia hole.

Step 6, on the base 1 subject to the step 5, forming a pattern includinga pixel defining layer (PDL) and a spacer (PS) through a singlepatterning process.

In this step, by using a half tone mask (HTM) or a gray tone mask (GTM),the pattern including the pixel defining layer and the spacer is formedfrom a coated material of a resin layer 13 (PI) through a singlepatterning process, as shown in FIG. 7.

On the basis of the above array substrate, an emitting layer (EL) isfurther evaporated or coated, and a metal cathode layer is finallyformed by a sputtering or evaporating, thus an array substrate with OLEDmay be formed by encapsulation.

In this embodiment, the via holes with which the drain 72 of the thinfilm transistor is connected with the drain contact region of the activelayer 3 and the via hole with which the drain 72 is connected with thepixel electrode 10 are formed by a single patterning process,simplifying process procedures. Also, among two plates of the storagecapacitor, one of the plates is made of a same metal material as that ofthe drain 72 and the source 71 of the thin film transistor TFT, and theother one of the plates is made of a same material as that of the activelayer 3 of the thin film transistor, thus a distance between two platesof the storage capacitor is decreased, avoiding a value of the storagecapacitance from being too small.

It should be noted that, in this embodiment, the gate 5 of the thin filmtransistor and the source and the drain may also be provided in a samelayer and manufactured through a single patterning process. At thistime, the gate 5 is below the active layer 3, that is, the thin filmtransistor is a top-gate type thin film transistor, other steps formanufacturing the array substrate are the same as those described aboveand will not be described in detail herein.

Second Embodiment

This embodiment provides an array substrate, which may be manufacturedby using the manufacturing method in the first embodiment, this arraysubstrate is applicable to OLED display devices.

This array substrate comprises a base 1, thin film transistors above thebase 1, storage capacitors and OLEDs.

This array substrate specifically comprises: a base 1; a source 71 and adrain 72 of the thin film transistor above the base 1; a firstinsulation layer 4′ above a layer in which the source 71 and the drain72 are located; an active layer 3 of the thin film transistor above thefirst insulation layer 4′; a second insulation layer above a layer inwhich the active layer 3 is located; a first connection line 81, asecond connection line 82 and a pixel electrode 10 above a layer inwhich the second insulation layer is located, wherein the firstconnection line 81 connects the source 71 with a source contact regionof the active layer 3 via a first via hole penetrating through the firstinsulation layer 4′ and the second insulation layer above the source 71and a third via hole penetrating through the second insulation layerabove the source contact region of the active layer 3; the secondconnection line 82 connects the drain 72 with a drain contact region ofthe active layer 3 and the pixel electrode 10 via a second via holepenetrating through the first insulation layer 4′ and the secondinsulation layer above the drain 72 and a fourth via hole penetratingthrough the second insulation layer above the drain contact region ofthe active layer 3.

The second insulation layer includes a gate insulation layer 6 and aplanarization layer 9, the array substrate further comprises a gate 5 ofthe thin film transistor provided between the gate insulation layer 6and the planarization layer 9. Furthermore, orthographic projections ofthe gate 5 and a conductive channel region of the active layer 3 on thebase 1 completely coincide with each other, and the source contactregion and the drain contact region of the active layer 3 are doped withions. That is to say, when doping the source contact region and thedrain contact region of the active layer 3 with ions, the gate 5 is usedas a mask, thus one mask may be saved, reducing the process cost.

The first plate 11 of the storage capacitor and the active layer 3 areprovided in a same layer and made of a same material, and the firstplate 11 is doped with ions therein, the second plate 12 and the drain71 and the source 72 are provided in a same layer and made of a samematerial, thus the distance between the two plates of the storagecapacitor is reduced, avoiding the value of the storage capacitance frombeing too small. Also, since the first plate 11 of the storage capacitorand the active layer 3 are in a same layer and made of a same material,and the first plate 11 is doped with ions therein, the second plate 12and the source 71 and the drain 72 are in a same layer and made of asame material, the first plate 11 and the active layer 3 may be formedsimultaneously, and the second plate 12 and the source 71 and the drain72 may be formed simultaneously, therefore, production cost may bedecreased

It should be noted that, in this embodiment, the gate 5 of the thin filmtransistor and the source and the drain may be provided in a same layerand manufactured through a single patterning process. At this time, thegate 5 is below the active layer 3, that is, the thin film transistor isa top-gate type thin film transistor, other components on the arraysubstrate are the same as those described above and will not bedescribed in detail herein.

Third Embodiment

This embodiment provides a display device, which comprises the arraysubstrate in the first embodiment.

The display device may a liquid crystal display device or an organiclight emitting diode display device, for example, any one of productsand components having display function, such as a liquid crystal panel,an electronic paper, an OLED panel, a mobile phone, a tablet computer, aTV, a display, a notebook computer, a digital frame, a navigation, andthe like.

The display device in this embodiment has excellent display quality.

The present application has following advantages:

In this application, the via hole with which the drain of the thin filmtransistor of the array substrate is connected with the drain contactregion of the active layer and the via hole with which the drain isconnected with the pixel electrode are formed by a single patterningprocess, simplifying process procedures. Also, among two plates of thestorage capacitor, one of the plates is made of a same metal material asthat of the drain and the source of the thin film transistor TFT, andthe other one of the plates is made of a same material as that of theactive layer of the thin film transistor, thus a distance between twoplates of the storage capacitor is decreased, avoiding a value of thestorage capacitance from being too small.

It can be understood that the foregoing implementations are merelyexemplary implementations used for describing the principle of thepresent application, but the present application is not limited thereto.Those of ordinary skill in the art may make various variations andimprovements without departing from the spirit and essence of thepresent application, and these variations and improvements shall fallinto the protection scope of the present application.

1. A manufacturing method of an array substrate, which comprisessequentially performed steps of: forming a pattern including a sourceand a drain of a thin film transistor on a base through a patterningprocess; forming a first insulation layer; forming a pattern includingan active layer of the thin film transistor through a patterningprocess; forming a second insulation layer, forming a first via hole anda second via hole in the first insulation layer and the secondinsulation layer above the source and the drain, respectively, byetching, and forming a third via hole and a fourth via hole in thesecond insulation layer above a source contact region and a draincontact region of the active layer, respectively, by etching; forming apattern including a first connection line, a second connection line anda pixel electrode through a patterning process, wherein the firstconnection line connects the source with the source contact region ofthe active layer through the first via hole and the third via hole, thesecond connection line connects the drain with the drain contact regionof the active layer and the pixel electrode through the second via holeand the fourth via hole.
 2. The manufacturing method of the arraysubstrate of claim 1, wherein the step of forming the second insulationlayer comprises a step of: forming a gate insulation layer and forming aplanarization layer, the manufacturing method further comprises a stepof: between forming the gate insulation layer and forming theplanarization layer, forming a pattern including a gate of the thin filmtransistor through a patterning process.
 3. The manufacturing method ofthe array substrate of claim 2, wherein orthographic projections of thegate and a conductive channel region of the active layer on the basecompletely coincide with each other, and after forming the patternincluding the gate through a patterning process, the manufacturingmethod further comprises a step of: performing an ion implantation onthe active layer to form the source contact region and the drain contactregion.
 4. The manufacturing method of the array substrate of claim 3,wherein while forming the pattern including the active layer of the thinfilm transistor through a patterning process, the manufacturing methodfurther comprises a step of: forming a pattern including a first plateof a storage capacitor, and while performing the ion implantation on theactive layer to form the source contact region and the drain contactregion, the manufacturing method further comprises a step of: performingan ion implantation on the first plate of the storage capacitor.
 5. Themanufacturing method of the array substrate of claim 1, wherein whileforming the pattern including the source and the drain of the thin filmtransistor through a patterning process, the manufacturing methodfurther comprises a step of: forming a pattern including the gate of thethin film transistor.
 6. The manufacturing method of the array substrateof claim 1, wherein while forming the pattern including the source andthe drain of the thin film transistor through a patterning process, themanufacturing method further comprises a step of: forming a patternincluding a second plate of the storage capacitor.
 7. The manufacturingmethod of the array substrate of claim 2, wherein while forming thepattern including the source and the drain of the thin film transistorthrough a patterning process, the manufacturing method further comprisesa step of: forming a pattern including a second plate of the storagecapacitor.
 8. The manufacturing method of the array substrate of claim3, wherein while forming the pattern including the source and the drainof the thin film transistor through a patterning process, themanufacturing method further comprises a step of: forming a patternincluding a second plate of the storage capacitor.
 9. The manufacturingmethod of the array substrate of claim 1, wherein the step of formingthe first via hole and the second via hole in the first insulation layerand the second insulation layer above the source and the drain,respectively, by etching; and forming a third via hole and a fourth viahole in the second insulation layer above the source contact region andthe drain contact region of the active layer, respectively, by etchingspecifically comprises steps of: first, etching regions, whichcorrespond to the first though hole and the second via hole, in thefirst insulation layer and the second insulation layer above the sourceand the drain; and next, etching regions, which correspond to the thirdvia hole and a fourth via hole, in the second insulation layer above thesource contact region and the drain contact region of the active layer.10. The manufacturing method of the array substrate of claim 9, whereinetching gas used in etching the second insulation layer to form thethird via hole and the fourth via hole is C_(x)F_(y).
 11. Themanufacturing method of the array substrate of claim 1, wherein afterthe pattern including the pixel electrode is formed, the manufacturingmethod further comprises a step of: forming a pattern including a pixeldefining layer and a spacer through a single patterning process.
 12. Anarray substrate comprising: a base; a source and a drain of a thin filmtransistor above the base; a first insulation layer above a layer inwhich the source and the drain are located; an active layer of the thinfilm transistor above the first insulation layer; a second insulationlayer above a layer in which the active layer is located; a firstconnection line, a second connection line and a pixel electrode above alayer in which the second insulation layer is located, wherein the firstconnection line connects the source with a source contact region of theactive layer via the first via hole penetrating through the firstinsulation and the second insulation layer above the source and thethird via hole penetrating through the second insulation layer above thesource contact region of the active layer , the second connection lineconnects the drain with a drain contact region of the active layer andthe pixel electrode via the second via hole penetrating through thefirst insulation layer and the second insulation layer above the drainand the fourth via hole penetrating through the second insulation layerabove the drain contact region of the active layer.
 13. The arraysubstrate of claim 12, wherein the second insulation layer includes agate insulation layer and a planarization layer, and the array substratefurther comprises a gate of the thin film transistor provided betweenthe gate insulation layer and the planarization layer.
 14. The arraysubstrate of claim 13, wherein orthographic projections of the gate anda conductive channel region of the active layer on the base completelycoincide with each other, and the source contact region and the draincontact region of the active layer are doped with ions.
 15. The arraysubstrate of claim 14, further comprising a first plate of a storagecapacitor, wherein the first plate and the active layer are in a samelayer and are formed of a same material, and the first plate is dopedwith ions.
 16. The array substrate of claim 12, further comprising agate of the thin film transistor, wherein the gate and the source andthe drain are in a same layer and are made of a same material.
 17. Thearray substrate of claim 12, further comprising a second plate of thestorage capacitor, wherein the second plate and the source and the drainare in a same layer and are made of a same material.
 18. The arraysubstrate of claim 13, further comprising a second plate of the storagecapacitor, wherein the second plate and the source and the drain are ina same layer and are made of a same material.
 19. A display devicecomprising the array substrate of claim
 12. 20. A display devicecomprising the array substrate of claim 13.